The Splash is a laboratory spray etching machine with integrated rinse. The machine is suitable for single and double-sided copper-clad base material. This equipment is designed with a special focus on ergonomic, clean and low carryover etching and rinsing.
Areas of application:
• acid or aqueous-alkaline etching of circuit boards, metal panels etc
• Developing of positive or negative-working photo resists or laminates (aqueous-alkaline process able – add anti foam if necessary).
- 100 µm line definition possible
- Professional Spray Etching Technology
- Alkaline Resist Stripping
- Etching speed with standard Fe-III-Cl: 35 µm Cu in 90s
- Max. board size 210 x 300 mm (Splash XL 300 x 400mm)
- Magnetic driven spray pump
- Built-in 1000 W heater
- Thermostat controlled
- Overheat protection
- Security lid switch
- Digital timer with count-down, auto-reset and beeper
- Special shadow-free PCB holder (titanium)
- Drop-off position for holder (see picture)
- Built-in pre rinse compartment with integral drop-off zone
- Also suitable for spray developing
Technical Data:
- Power supply: 230 V~, 50 Hz approx. 1150 VA
- Dimensions (L x W x H): 60 x 66 x 120 cm (Splash XL 80 x 120 x 65 cm)
- Tank capacity: 25 l (Splash XL 40l)
- Weight: 30 kg (Splash XL 40kg)
