Solder Paste formulated for lead free surface mount assemblies requiring excellent, defect free soldering of even the most difficult to solder components and board finishes, including OSP, ENIG, Ag, Sn and HASL.
This Solder Paste leaves a minimal clear, halogen free, post reflow residue. Tested to Industry standards including J- STD 004B and Bellcore (ECM), the residues can be considered safe to remain on an assembly when no- clean technology is appropriate to the assembly end- use. The solder paster offers excellent print definition for fine and ultra – fine pitch printing and offers extended tack and open times in excess of three days.
Incorporating a unique ‘ Sparkle – Bright’ polymer additive, this solder paste leaves a bright solder finish compared with many competitor products which are prone to dulling when using SAC and many other Sn based lead free solder alloys. This Solder Paste represents the next generation in lead free soldering.
Benefits
• Halogen Free for increased reliability
• Reduces and eliminates voiding and heading – pillow defects
• Powerful wetting on all board finishes
• Shiny joint finish
• Clear minimal residue
• Long tack and open times
• 12 months refrigerated shelf life
