Raw Double Sided Copper Clad FR4 Epoxy glass Laminate material ideal for the production of high quality printed circuit boards with CNC Isolation Routing Drilling Machines, Dry Film Laminators, Screen Printed Resists, LDI Laser Direct Imaging and Etching processes. All laminate is manufactured and tested in accordance with IPC4101C/21
By special request the material can be cut to any required size.
| Specifications: | |
| Thickness | 1.6mm |
| Copper foil | 35 micron/1oz |
| Dissipation factor | 35 |
| Dielectric constant | 5.4 |
| Solderbath resistance (260°C) | 20 secs |
