£0.90 – £7.50
Raw Single sided PCB Copper Clad Laminate material suitable for use with CNC Isolation Routing Drilling Machines, Dry Film Laminators, Screen Printed Resists, LDI Laser Direct Imaging or Etch resist tranfers such as “Press n Peel” or ink Etch resist pen. Suitable etchant Ferric Chloride or fine etch crystals.
Copper Clad Board Fr4 Laminate sheet ideal for the production of high quality fine line printed circuit boards when using CNC Isolation Routing Drilling Machines, Dry Film Laminators, Screen Printed Resists, LDI Laser Direct Imaging and Etching processes. All laminate manufactured and tested in accordance with IPC4101C/21
| Specifications: | |
| FR4 Fibreglass Thickness | 1.6mm |
| Copper foil | 35 micron 1 Oz |
| Dissipation factor | 35 |
| Dielectric constant | 5.4 |
| Solderbath resistance (260°C) | 20 secs |
| Weight | 0.075 kg |
|---|---|
| Size (Sheet) | 510 x 1150 x 1.6mm, 233.4 x 160 x 1.6mm, 100 x 160 x 1.6mm, 305 x 457 x 1.6mm, 100 x 220 x 1.6mm, 233.4 x 220 x 1.6mm, 203 x 114 x 1.6mm, 510 x 1150 x 0.8mm |
