Low residue Roller Tinning Flux based on biodegradable wetting agents that can be used with both leaded and unleaded solder tinning applications. Used for cleaning and removing copper oxidisation from the surface of copper clad printed circuit boards (PCBs) prior to Roller Tinning to give high quality bright residue free tin deposits. Features include:-
-Complete tinning coverage upon a single pass when used in conjunction with the recommended tinning cover salts
-No spitting during processing of printed circuit boards
-Easily applied with a hard roller (Preferably none absorbing)
-Low foam generation upon rinsing
-Safe to use with normal precautions
It is recommended after tinning to place circuit boards under clean running water or spray rinsed to remove any corrosive flux residue
Flux solution is Supplied in a 5 litre container.
